| 摘要 |
A method of cutting a solid material using a pulsed laser includes providing a pulsed laser beam, selecting a target point in the solid material, focusing the pulsed laser beam on the solid material such that at the target point in the solid material the pulsed laser beam has at least the minimum energy density required to ablate the solid material, and effecting relative motion of the pulsed laser beam with respect to the solid material such that the pulsed laser beam traces a first path to form a scribe line in the solid material and then a second path to form a second scribe line in the solid material, wherein the first path and the second path are essentially parallel and the first and second scribe lines overlap to form a single cut line in the solid material.
|
