发明名称 POLYIMIDE RESIN COMPOSITION, POLYIMIDE PRECURSOR RESIN COMPOSITION FOR PROVIDING THE POLYIMIDE RESIN COMPOSITION, THEIR PRODUCTION METHODS, POLYIMIDE FILM AND METHOD FOR PRODUCING THE POLYIMIDE FILM
摘要 Disclosed is a polyimide precursor resin composition having excellent transparency, which is reduced in the residual volatile content during molding even when a lower-cost polyamide imide is used. This polyimide precursor resin composition is capable of forming a polyimide resin composition (such as a polyimide film) which is excellent in mechanical properties and transparency. Specifically disclosed is a polyimide precursor resin composition containing a polyamide imide (A) containing a diamine monomer unit represented by the formula (1) below, and a polyamic acid (B) containing at least one monomer unit selected from tetracarboxylic acidmonomer units represented by the formulae (2p)-(2r). When this polyimide precursor resin composition is imidized into a film having a thickness of 40 µm, the thus-obtained film has a haze of not more than 4%. (In the formula (1), R represents an alkylene group having 1-5 carbon atoms.)
申请公布号 WO2009022619(A1) 申请公布日期 2009.02.19
申请号 WO2008JP64190 申请日期 2008.08.07
申请人 UNITIKA LTD.;YOSHIDA, TAKESHI;SHIGETA, AKIRA;ECHIGO, YOSHIAKI 发明人 YOSHIDA, TAKESHI;SHIGETA, AKIRA;ECHIGO, YOSHIAKI
分类号 C08L79/08;C08G73/10 主分类号 C08L79/08
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