发明名称 |
POLYIMIDE RESIN COMPOSITION, POLYIMIDE PRECURSOR RESIN COMPOSITION FOR PROVIDING THE POLYIMIDE RESIN COMPOSITION, THEIR PRODUCTION METHODS, POLYIMIDE FILM AND METHOD FOR PRODUCING THE POLYIMIDE FILM |
摘要 |
Disclosed is a polyimide precursor resin composition having excellent transparency, which is reduced in the residual volatile content during molding even when a lower-cost polyamide imide is used. This polyimide precursor resin composition is capable of forming a polyimide resin composition (such as a polyimide film) which is excellent in mechanical properties and transparency. Specifically disclosed is a polyimide precursor resin composition containing a polyamide imide (A) containing a diamine monomer unit represented by the formula (1) below, and a polyamic acid (B) containing at least one monomer unit selected from tetracarboxylic acidmonomer units represented by the formulae (2p)-(2r). When this polyimide precursor resin composition is imidized into a film having a thickness of 40 µm, the thus-obtained film has a haze of not more than 4%. (In the formula (1), R represents an alkylene group having 1-5 carbon atoms.) |
申请公布号 |
WO2009022619(A1) |
申请公布日期 |
2009.02.19 |
申请号 |
WO2008JP64190 |
申请日期 |
2008.08.07 |
申请人 |
UNITIKA LTD.;YOSHIDA, TAKESHI;SHIGETA, AKIRA;ECHIGO, YOSHIAKI |
发明人 |
YOSHIDA, TAKESHI;SHIGETA, AKIRA;ECHIGO, YOSHIAKI |
分类号 |
C08L79/08;C08G73/10 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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