STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP

摘要

Chip packages and a related method are disclosed that provide a structure on a side opposite a chip on a carrier of a chip package to substantially match a stiffness of the chip. In one embodiment, a chip package includes a chip coupled to a carrier; and a structure on a side opposite the chip on the carrier, the structure having a first stiffness to substantially match a second stiffness of the chip.