| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad easy to separate from a surface plate, and to provide a manufacturing method for a semiconductor device using the same. <P>SOLUTION: The polishing pad 1 comprises a polishing layer laminated on the single face of a cushion layer, and a rigid layer laminated on the other face of the cushion layer and having a bending elastic modulus higher than each of the polishing layer and the cushion layer. The rigid layer is a resin sheet which has a bending elastic modulus of 1,000-10,000 MPa and a thickness of 40-300 μm. <P>COPYRIGHT: (C)2009,JPO&INPIT |
