| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of expecting a higher density wiring and a higher density packaging of a circuit board. SOLUTION: BGA parts 10 are constituted by being equipped with: a substrate 12 which loads a semiconductor chip 11 treating a differential signal on a front surface thereof and arranges, for example, plural solder balls 18, 18, ..., 18 becoming external connection electrodes on a rear face thereof; a pair of differential lines 14 and a pair of differential lines 15 which are provided on the front surface of this substrate 12 and carry out a circuit connection between the semiconductor chip 11 and a pair of the predetermined solder balls 18; and a pair of coupling capacitors 13 sandwiched between the differential lines 14, 15. COPYRIGHT: (C)2009,JPO&INPIT
|
