| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent peeling between a wire bonding pad and a sealing resin at the time of secondary packaging. <P>SOLUTION: A circuit pattern containing a wire bonding pad 6 and a through via 8 on a substrate body 4 is formed like a pinched-in gourd. Then, a region required for wire bonding is obtained, minimizing a region covered with gold plating. When sealing with resin is performed, resin goes into a bottomed via 7 formed near a region with a narrow width of the wire bonding pad 6, and anchor effect is demonstrated. After that, the wire bonding pad 6 and the sealing resin are firmly adhered. As a result, peeling between the wire bonding pad 6 and the sealing resin can be prevented at the time of secondary packaging. <P>COPYRIGHT: (C)2009,JPO&INPIT |
