SEMICONDUCTOR PACKAGE, STACKED MODULE, CARD, SYSTEM, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package allowing many conductive bumps to be arranged at a fine pitch therein, to provide a manufacturing method thereof, to provide a stacked module, to provide a card, and to provide a system.

SOLUTION: A semiconductor package 100 includes: a package substrate 110 having opposed first and second surfaces 112 and 114 and including a bend part 105; one or more semiconductor chips 125 stacked on the first surface of the package substrate and disposed on or under the bend part; and a plurality of conductive bumps 140 attached on the second surface of the package substrate.

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