| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board for not occupying many wiring areas even when a line width is increased in order to reduce signal attenuation in high-speed signal transmission. SOLUTION: While gradually increasing the widths of lines 104a, 104b, 105a and 105b of first and second groups of differential signal lines 104 and 105 to suppress attenuation in the lines, the opening widths of slits 104s and 105s formed in a GND layer 102 below the respective differential signal lines are similarly changed. Thereby, impedance matching is realized. Further, by alternately disposing a large-width side and a small-width side of the two differential signal lines 104 and 105, the total line widths are reduced. COPYRIGHT: (C)2009,JPO&INPIT |
