发明名称 CONDUCTING SPACER
摘要 PROBLEM TO BE SOLVED: To provide a conducting spacer which comes into contact with and conducts to an end face of a metal member. SOLUTION: The conducting spacer 1 comprises a substrate portion 2 and a conductor portion 3, and surface mounting can be performed by soldering a soldering portion 17 of the conductor portion 3 to a printed circuit board. Moreover, the soldering portion 17 and an upper face 5 of the substrate portion 2 function as a spacer. As a contact portion 20 projects into a side face of an adsorption projection which projects from the upper face 5, when the contact portion 20 is inserted into a throughhole or the like of the metal member, and a relay portion 18 is elastically deformed, the contact portion 20 is pressed and put into contact with an inner periphery of the throughhole. Since surface treatment is not applied to an inner peripheral face, better conduction is obtained due to contact of the contact portion 20 with the inner peripheral face. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009038336(A) 申请公布日期 2009.02.19
申请号 JP20080057880 申请日期 2008.03.07
申请人 KITAGAWA IND CO LTD 发明人 KURITA TOMOHISA;MAJIMA MIKIO
分类号 H05K1/18 主分类号 H05K1/18
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