发明名称 |
METHOD AND APPARATUS FOR COOLING ELECTRONICS WITH A COOLANT AT A SUBAMBIENT PRESSURE |
摘要 |
<p>According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.</p> |
申请公布号 |
EP2024692(A2) |
申请公布日期 |
2009.02.18 |
申请号 |
EP20070755199 |
申请日期 |
2007.04.10 |
申请人 |
RAYTHEON COMPANY |
发明人 |
RUMMEL, KERRIN, A.;WYATT, WILLIAM, G.;WEBER, RICHARD, M. |
分类号 |
F25B23/00;F25B43/00 |
主分类号 |
F25B23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|