发明名称 |
Heatsink attachment mechanism |
摘要 |
Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.
|
申请公布号 |
US7492598(B2) |
申请公布日期 |
2009.02.17 |
申请号 |
US20060533514 |
申请日期 |
2006.09.20 |
申请人 |
CISCO TECHNOLOGY, INC. |
发明人 |
NARASIMHAN SUSHEELA;NGUYEN NGUYEN T.;SAYED SAEED;KADIVAR MOHAMMAD REZA DANESH |
分类号 |
H05K7/20;F28F7/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|