| 摘要 |
A wafer stamped with magnetism mark is provided to prevent wafer cutting or contaminant deposition by forming a magnetism mark on the fixed position of wafer through the coating or drying of the magnetic paint. In a wafer stamped with magnetism mark, an ingot is produced by growing the silicon crystal. The slicing process of the ingot is performed and the wafer(3) is prepared by polishing the ingot. A plurality of wafers is arranged by the regular interval and they are accepted in a carrier by a lot unit and are transferred. The magnetic paint is covered on the stamp, and one side of wafer is pressurized by the stamp and magnetic paint is spread on the wafer. The magnetic paint is the same material as the magnetic paint used for the general magnetic tape. The magnetic paint is coated on the edge one side of the wafer.
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