| 摘要 |
An apparatus and method for treating a substrate is provided to reduce a processing time by performing ashing and cleaning process in one apparatus. In an apparatus and method for treating substrate, a supporting member(120) is the inner structure of housing and support the substrate. A cleaning nozzle(142) supplies washing solution to the substrate on the supporting member. An electrode member(160) activates a process gas supplied from the processing gas supply device. The processing gas supply device(130) comprises a process gas supply line(134) and a supply port(132). The supply port receives the process gas from the process gas supply line and supplies the process gas to inside of the housing.
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