发明名称 THIN-FILM ELEMENT AND ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To make a film to be annealed, which allows short-wavelength light having intensity that is likely to damage a substrate to transmit therethrough, into a good-quality inorganic film by annealing the film to be annealed without damaging a resin substrate, in a method for manufacturing a thin-film element provided with the inorganic film obtained by emitting short-wavelength light to the film to be annealed that is formed on the resin substrate and made of a non-single crystal film. <P>SOLUTION: A thin-film element 1 is manufactured by executing the following steps: a step (A) for preparing a substrate 10 mainly composed of a resin material; a step (B) for forming a thermal buffer layer 50 on the substrate 10; a step (C) for forming a light-cutting layer 20 on the thermal buffer layer 50, wherein the light-cutting layer 20 prevents the substrate 10 from being damaged by short-wavelength light L while reducing an arrival rate of the short-wavelength light L at the substrate 10; a step (D) for forming a film 30a to be annealed, which allows the short-wavelength light L having intensity that is likely to damage the substrate 10 to transmit therethrough and is made of a non-single crystal film, on the light-cutting layer 20; and a step (E) for forming an inorganic film 30 by annealing the film 30a to be annealed while emitting the short-wavelength light L to the film 30a to be annealed. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009033004(A) 申请公布日期 2009.02.12
申请号 JP20070197001 申请日期 2007.07.30
申请人 FUJIFILM CORP 发明人 TANAKA ATSUSHI;UMEDA KENICHI;AZUMA KOHEI;SUNAKAWA HIROSHI;KODA KATSUHIRO
分类号 H01L21/20;G02F1/1333;G02F1/1368;H01L21/336;H01L29/786;H01L51/50 主分类号 H01L21/20
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