发明名称 WIRING BOARD, ITS MANUFACTURING METHOD, AND DISPLAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board capable of extending the allowable error range of alignment accuracy in the package of a packaging terminal and an external circuit, to provide its manufacturing method, and to provide a display device. SOLUTION: The wiring board includes a plurality of wiring lines 2a provided on a board 1 and a plurality of packaging terminals 6 respectively provided on the plurality of wiring lines 2a and forming a plurality of rows in a zigzag shape. The packaging terminal 6 includes a first conductive film 2 of the same layer as the wiring line 2a, an insulating film 4 covering the wiring line 2a and the first conductive film 2 and having an aperture part 5 on the first conductive film 2 and an upper layer conductive film 7 electrically connected to the first conductive film via the aperture part 5. The insulating film 4 has a thick film part provided outside the region where the plurality of packaging terminals 6 forming the plurality of rows in the zigzag shape are provided and a thin film part 5a provided in a region adjacent to the aperture part 5 in the row direction in the zigzag shape and having film thickness thinner than that of the thick film part. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009031362(A) 申请公布日期 2009.02.12
申请号 JP20070192477 申请日期 2007.07.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 HASHIGUCHI TAKASHI
分类号 G02F1/1345;G02F1/1368 主分类号 G02F1/1345
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