| 摘要 |
A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided. An alkaline aqueous solution-soluble photosensitive resin composition containing an alkaline aqueous solution-soluble resin (A) obtained by adding a polybasic acid anhydride (c) to a resin (C) which is a reaction product of an epoxy resin (a) represented by the formula (1) with an unsaturated monocarboxylic acid (b), an epoxy resin (a') represented by the formula (1) as a curing agent (B) and a photopolymerization initiator. [In the formula, n represents a positive number of 1 to 10 as an average value.]
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