Resin formulation with cross-linkable bismaleimide-component, useful e.g. for manufacturing electrically isolating sealing compound, and foil comprises bismaleimide-component having bismaleimide phenylindane

摘要

Resin formulation (I) with at least one cross-linkable bismaleimide-component comprises bismaleimide-component having bismaleimide phenylindane (II). Resin formulation (I) with at least one cross-linkable bismaleimide-component comprises bismaleimide-component having bismaleimide phenylindane of formula (II). R 1-R 3optionally saturated organic residue of e.g. methyl (preferred), ethyl or phenyl. Independent claims are included for: (1) use of (I) for manufacturing foil with the following steps: (a) providing (I), (b) molding processes of the (I) and (c) initiating the cross-linking of (II) of (I); and (2) use of the foil for planer contacting of an electrically contacting place of an electrical building element with the following steps: providing the building element with the contact place, laminating the foil on the building element, so that the contact place is covered by the foil, exposing the contact place of the element by opening of a window (121) in the foil, and contacting the electrical contact place through the window. [Image].