发明名称 Method for depositing a metallic substrate on a wall
摘要 In one aspect, a method for depositing a metallic substrate on a wall of a narrow depression of a metallic component is provided. A wire electrode is introduced into the depression and thereby bent in the direction of the wall by means of a guide. A suitable voltage is applied to the component and to the wire electrode in order to create an arc, which melts the wire electrode in certain regions. The molten material of the wire electrode is thereby deposited on the wall of the component. The wire electrode is progressively fed in during the depositing operation.
申请公布号 US2009041953(A1) 申请公布日期 2009.02.12
申请号 US20080156594 申请日期 2008.06.02
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 FAJARDO-REINA SCARLETT;GRUGER BIRGIT;GUNZELMANN KARL-HEINZ;JANSSEN WOLFGANG;NIEPOLD KARSTEN
分类号 H05H1/48 主分类号 H05H1/48
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