Herstellungsverfahren für ein Kameramodul

摘要

A cover glass (11) covers only light-receiving elements (9) formed on a semiconductor substrate (8) of a solid-state imaging device (5). The other area of the substrate except the light-receiving elements is exposed. An FPC (6) interposed between an optical unit (4) and the solid-state imaging device is formed with an opening (23) for exposing the cover glass and an assembly reference surface (16a) of the solid-state imaging device. When the solid-state imaging device is attached to the optical unit, the center of the light-receiving elements is determined as a reference position. The optical unit is directly attached to the assembly reference surface so as to make the reference position coincide with a photographic optical axis of the optical unit.