| 摘要 |
An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent flame retardancy without the use of a halogen-based flame retardant, and to improve moldability and reliability by using a deoxybenzoin-based polyarylate as a flame retardant. An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resin, curing agent, curing accelerator, inorganic filler and flame retardant. The flame retardant is a deoxybenzoin-based polyarylate indicated as the chemical formula 1. In the chemical formula 1, the average of n is 10-100. The deoxybenzoin-based polyarylate has the average molecular weight of 10,000~30,000 and is used in the amount of 0.01~10 weight% based on the total epoxy resin composition.
|
