发明名称 FILM OPTICAL WAVEGUIDE PACKAGE, FILM OPTICAL WAVEGUIDE MODULE AND ELECTRONIC DEVICE
摘要 A package (5) is composed of a supporting section (5a) and a cover section (5b). The supporting section supports a light emitting section (7) which transmits or receives an optical signal or supports a light receiving section (9) which receives the optical signal. The cover section covers the supporting section (5a). The supporting section (5a) or the cover section (5b) has an optical waveguide mounting surface (22), which supports at least one end section including an input/output port of the optical signal on an optical waveguide (4). The optical waveguide transmits the optical signal by being optically coupled with the light emitting section (7) or the light receiving section (9). A length (D) in an Z axis direction vertical to the optical waveguide mounting surface (22), from the optical waveguide mounting surface (22) of the supporting section (5a) or that of the cover section (5b) to the cover section (5b) or the supporting section (5a) facing the optical waveguide mounting surface (22) is longer than a distance (d) of the optical waveguide (4) in a Z axis direction in a region supported by the optical waveguide mounting surface (22). Thus, the optical waveguide package having a structure wherein a core section is not easily deformed or broken even when a shock due to vibration or the like is applied is provided.
申请公布号 WO2009020165(A1) 申请公布日期 2009.02.12
申请号 WO2008JP64162 申请日期 2008.08.06
申请人 OMRON CORPORATION;SAMESHIMA, HIROSHI;YASUDA, NARU;HOSOKAWA, HAYAMI 发明人 SAMESHIMA, HIROSHI;YASUDA, NARU;HOSOKAWA, HAYAMI
分类号 G02B6/13;G02B6/122;G02B6/42 主分类号 G02B6/13
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