| 摘要 |
A substrate processing apparatus is provided to supply the uniform plasma to the entire substrate by reciprocating a plurality of electrodes. The substrate processing apparatus comprises the supporting member(110) in which the substrate is mounted. A plurality of electrodes(230) is disposed at the top of substrate and is in opposite directions to the substrate. The plasma is generated through the reaction with the source gas by applying the power. The cover(250) is arranged on the top of the supporting member. A plurality of electrodes is accommodated. The position control part reciprocates a plurality of electrodes to the direction of a plurality of electrodes. The relative position between the substrate and a plurality of electrodes is changed.
|
