发明名称 Fixing Structure and Heat Dissipation Device
摘要 A fixing structure includes a back plate, a fixing plate, a first elastic element, a second elastic element and a fastener. The back plate has a positioning pillar thereon. The fixing plate presses a heat dissipation element to allow the heat dissipation element to contact a chip above the back plate. Both the first elastic element and the second elastic element are connected to the fixing plate. The fastener fastens the first elastic element and the second elastic element to the positioning pillar or just fastens the first elastic element to the positioning pillar to allow the second elastic element to be suspended. Furthermore, a heat dissipation device employing the fastening structure is also disclosed.
申请公布号 US2009040728(A1) 申请公布日期 2009.02.12
申请号 US20080173097 申请日期 2008.07.15
申请人 ASUSTEK COMPUTER INC. 发明人 CHEN CHI-CHUAN;WU MING-HSIU
分类号 H05K7/20 主分类号 H05K7/20
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