发明名称 SUBSTRATE ASSEMBLING DEVICE AND ASSEMBLING METHOD
摘要 PROBLEM TO BE SOLVED: To accurately stack and assemble a plurality of substrates by preventing the damage and breakage of the substrates from developing by realizing the sure and stable release at the release of a protective sheet from the substrate equipped with the protective sheet for covering a bonding layer owing to no necessity of the employment of a high bonding force releasing tape. SOLUTION: This substrate assembling device and the like is equipped with a chuck retaining means 7 for chuck retaining the side with no bonding layer 102 of one substrate 101, an impacting means 105 for impacting the surface of the protective sheet stretching over two adjacent sides of the protective sheet 103 of one substrate, a film releasing means 9 for bringing the releasing tape 30 into contact with the surface of the protective sheet floated by the giving of impact so as to release the protective sheet, a substrate conveying means 5 for placing the other substrate on the bonding layer exposed after the releasing of the protective layer, and a thrusting means 11 for thrusting both the substrates in the directions of approaching each other. The lamination of≥3 sheets of substrates and their assembling are also possible. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009029014(A) 申请公布日期 2009.02.12
申请号 JP20070195270 申请日期 2007.07.27
申请人 NEC ENGINEERING LTD 发明人 MORI SHOJI;ISHIZUKA TOSHIHIKO
分类号 B29C65/78;B29C63/02;B65H29/54 主分类号 B29C65/78
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