| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sensor device which ensures the state of electrical connection between a sensor chip and an external connection terminal and suppresses damage to a thin wall portion and change in sensor characteristics. <P>SOLUTION: The sensor device has the sensor chip which has a detecting part and a wiring part formed on a semiconductor substrate having a hollow portion and which has a resistor constituting the detecting part and formed in the thin wall portion on the hollow portion, a support member on one surface of which the sensor chip is fixed by adhesion, with the lower side thereof made a mounting surface, the external connection terminal which is connected electrically to the wiring part, and a sealing resin which is disposed integrally so that it covers the part of connection of the wiring part and the external connection terminal and that the detecting part and the thin wall portion are exposed. At least one first recess is formed in at least either a part of the lower side of the sensor chip or a part of the area on one side of the support member being opposite to the lower side of the chip, so that the recess is not adjacent to an opening area of the hollow part or to an area corresponding to the opening area. An adhesive is disposed in the first recess and thereby the part of the lower side of the sensor chip is fixed by adhesion to the support member. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
