发明名称 PLATING HOLDER USED FOR PLATING OF RESIN MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a new plating holder used for plating of a resin molded article, capable of preventing the deposition of electroless plating to the holder even when performing etching by means of an etching liquid which includes a permanganate as an active principle. SOLUTION: The plating holder used for plating of resin molded article is provided, wherein all of insulation cover part or at least a part of the insulation cover part of the plating holder is formed from a coating film including at least one selected from the group consisting of silicone resin and olefin-based resin. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009030151(A) 申请公布日期 2009.02.12
申请号 JP20070288635 申请日期 2007.11.06
申请人 OKUNO CHEM IND CO LTD 发明人 YOSHIKAWA JUNJI;NAGAO TOSHIMITSU;YOSHIKANE YUSUKE;MORIMOTO TORU;MURATA TOSHIYA
分类号 C25D17/08;C23C18/31;C25D17/06 主分类号 C25D17/08
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