EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent flame retardancy without the use of a halogen-based flame retardant, good moldability in the semiconductor device packaging and excellent bending property and reliability of package. An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resin, curing agent, curing accelerator and inorganic filler. The curing agent is a biphenyl-containing modified phenol novolac type phenol resin indicated as the chemical formula 1. In the chemical formula 1, the average of m and n is respectively 1-10. The order of two repeating units can be arranged in the chemical formula 1 randomly.