| 摘要 |
A probe card, and the method of manufacturing the semiconductor device and the apparatus for inspection of semiconductor are provided to inspect the probing without a damage of the electrode pad of non- contact object. The probe card comprises a plurality of contact pins(10), and the wiring and the probe sheet(9). A plurality of contact pins contacts the formed electrode with the object to be tested. The wiring is drawn from the plurality of contact pins. The probe sheet comprises a plurality of peripheral electrodes(16). A plurality of peripheral electrodes is electrically connected to the wiring and is connected to the electrode of the multilayer wiring substrate. A plurality of contact pins is surrounded by the frame(5).
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