| 摘要 |
<p>The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. The semiconductor device (1) includes a semiconductor module (2) in which a semiconductor element is sealed with a resin, a reinforcing beam (4) fixed to an upper surface of the semiconductor module (2) via a plate-like spring (3), and a frame part (6) to which both ends of the reinforcing beam (4) are fixed, the frame part (6) being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module (2), plate-like spring (3), and the reinforcing beam (4).</p> |
