| 摘要 |
A method of forming a barrier layer of a tunneling magnetoresistive (TMR) device by forming first and second MgO barrier layers by different sputtering methods, but in the same sputtering system module. A first magnesium-oxide (MgO) barrier layer is formed over one of the TMR device's ferromagnetic layers by a DC magnetron sputter deposition from an Mg target in an oxygen environment. In the same module, a second MgO barrier layer is formed over the first MgO film by an RF sputter deposition from an MgO target and in an environment free of oxygen. Prior to the formation of the first MgO barrier layer, an optional Mg protection layer can be deposited on the ferromagnetic layer and oxidized by a first optional oxygen treatment. After deposition of the first MgO barrier layer, a second optional oxygen treatment may be conducted. After deposition of the second MgO barrier layer, a second Mg protection layer may be deposited by DC sputter deposition, followed by an optional third oxygen treatment.
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