| 摘要 |
<p>A low temperature cofired ceramic package and a manufacturing method thereof are provided to prevent wire bonding fail of a plurality of electronic devices having step height. A low temperature cofired ceramic package includes a first ceramic layer ~ a fifth ceramic layer(300, 306, 312, 320, 326). The first ceramic layer includes bottom electrodes(302) and first vias(304). The first vias are connected to a second vias(308) of the second ceramic layer. The third ceramic layer includes top electrodes(316) and third vias. The third vias are connected to the second vias.</p> |
