THE MANUFACTURING METHOD OF THE ANTENNA FUNCTION WHICH USES THE NO ELECTROLYSIS COPPER PLATING, NO ELECTROLYSIS NICKEL PLATING IN THE CIRCUIT PATTERN DUE TO THE DUPLEX SHOOTING OUT OF HANDSET HOUSING

摘要

A manufacturing method of antenna function using electroless copper plating and electroless nickel plating in circuit pattern is provided to perform slim size by reducing thickness of a cell phone. Base material is mixed resin of PC(PolyCarbonate) 40% and ABS(Acrylonitrile Butadiene Styrene copolymer) 60%. An activator process is performed(8). A catalyst is activated by an accelerator process(10). A film is formed on a circuit pattern by electroless copper striker process(12). A copper plating is performed(13). The copper plating is activated by a catalyst activation process(15). A nickel metal film is formed with electroless nickel plating process(16).