| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive dry film resist which can be subjected to aqueous developing and is excellent in resolution and low warping property, a printed wiring board using the same, and a method for producing the printed wiring board. <P>SOLUTION: The photosensitive dry film resist of a multilayer structure including at least a first photosensitive layer and a second photosensitive layer is used. The first photosensitive layer contains, as essential components, (A1) binder polymer, (B1) (meth)acrylic compound, (C1) photoreaction initiator and (D1) flame retardant, the second photosensitive layer contains, as essential components, (A2) binder polymer and (B2) (meth)acrylic compound, and substantially free from (D2) flame retardant, with a flame retardant content of the second photosensitive layer being 0-10 wt.%, while satisfying that the flame retardant content of the second photosensitive layer is 0-50 when the frame retardant content of the first photosensitive layer is 100, and the first photosensitive layer is less warped than the second photosensitive layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
