发明名称 SPUTTER COATING DEVICE AND METHOD OF DEPOSITING LAYER ON SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a device and a method for damage free or damage-reduced sputter coating on top of an organic material layer, e.g. on top of an OLED layer, the method having an acceptable coating ratio. SOLUTION: The sputter coating device comprises: a coating chamber; substrates 110a, 110b each having an organic material layer deposited thereon; at least a rotatable cathode unit arranged in the coating chamber comprising at least one rotatable target 102 and a magnet assembly 104 for generating at least one plasma confinement zone arranged above at least one surface section of the target 102; scattering zone for scattering the sputtered particles; and means for selectively preventing a portion of the sputtered particles from moving to the substrate surface. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009024259(A) 申请公布日期 2009.02.05
申请号 JP20080187935 申请日期 2008.07.18
申请人 APPLIED MATERIALS INC 发明人 SCHOLHAMMER JIM;UWE HOFFMAN;DIEGUEZ-CAMPO JOSE MANUEL
分类号 C23C14/34 主分类号 C23C14/34
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