发明名称 SOLID-STATE IMAGING ELEMENT, SOLID-STATE IMAGING DEVICE, CAMERA, AND DRIVE METHOD
摘要 A semiconductor device is a solid-state imaging element formed on a semiconductor substrate and having an overflow drain structure which discharges an excessive charge generated in a plurality of photoelectric elements (1). The solid-state imaging element reads out a signal charge accumulated in the photoelectric conversion element (1) and reads it out via a gate electrode (18) to a vertical transfer unit (2a). The solid-state imaging element includes: a first voltage generation circuit which applies to the semiconductor substrate, a substrate voltage which defines the overflow barrier height in the overflow drain structure; and a second voltage generation circuit which selectively generates a first voltage and a second voltage indicating the wave height of a pulse superposed on the substrate voltage at a generation timing of a read-out pulse applied to the read-out gate electrode (18).
申请公布号 WO2009016798(A1) 申请公布日期 2009.02.05
申请号 WO2008JP01834 申请日期 2008.07.09
申请人 PANASONIC CORPORATION;HASUKA, TSUYOSHI;KURIYAMA, TOSHIHIRO;MORI, HIROYUKI;MANABE, JUNJI 发明人 HASUKA, TSUYOSHI;KURIYAMA, TOSHIHIRO;MORI, HIROYUKI;MANABE, JUNJI
分类号 H01L27/148;H04N5/335;H04N5/347;H04N5/359;H04N5/369;H04N5/372 主分类号 H01L27/148
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