| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of forming a thin wiring layer which is an outermost layer of a multilayer printed wiring board while securing high reliability and capable of securing high wiring density in a multilayer printed wiring board. SOLUTION: A method of manufacturing the multilayer printed wiring board 1 is a method of forming wiring layers 21, 24 which are outermost layers of the wiring board by forming a first plating layer 81 continuing from a via hole 5 on a conductive metal foil 14 adhered to the surface of an insulating layer which is an outermost layer, by forming a second plating layer 82 covering the first plating layer 81 continuously from a through bore 6 and by forming a wiring pattern on a multilayer conductive layer 16 produced by laminating the conductive metal foil 14, the first plating layer 81 and the second plating layer 82. This multilayer printed wiring board 1 is a wiring board in which the second plating layer 82 is formed covering the first plating layer 81. COPYRIGHT: (C)2009,JPO&INPIT |
