发明名称 HEAT TREATING DEVICE
摘要 PURPOSE:To make the conveying mechanism at the heat treatment simple and perform smooth and stable conveying of the materials to be heat-treated by controlling the in-furnace circulation of the materials to be heat-treated by way of an intermittently moving chain. CONSTITUTION:Wafers 4... being the materials to be heat-treated which are transferred in by a transfer-in mechanism 20 such as endless belt are moved upward, pitch by pitch, by the carriers 26... provided to the wafer conveying devices 15... of a chain 14 which is moved, pitch by pitch, by a driving source 16 and penetrates through the furnace walls of which the parallel parts are adjusted slightly higher on the transfer-in side than on the discharge side. The wafers 4... are moved onto the corresponding descending side carriers 26... of the chain 14 by the pusher 25 which is driven cooperatively with the intermittent driving and stopping of the chain 14 of the horizontal moving mechanism 17 provided in the specified position, after which they are moved downward by the chain 14 and are discharged by a discharge mechanism 21 such as endless belt. By the simple conveying mechanism using the chain or the like which is intermittently driven in one direction only, the wafers, etc. are smoothly and stably conveyed in the furnace and good heat treatment is done.
申请公布号 JPS566238(A) 申请公布日期 1981.01.22
申请号 JP19790081387 申请日期 1979.06.29
申请人 HITACHI LTD 发明人 SUMITOMO KENJI
分类号 G03F7/16;G03F7/00;G03F7/40 主分类号 G03F7/16
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