| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is superior in heat dissipation and reliability. SOLUTION: The semiconductor device is provided with a wiring substrate 10 wherein a wiring pattern 12 is provided on its surface; a first semiconductor chip 1 mounted on the surface of the wiring substrate 10; a first heat plate 30 which is in contact with the surface of the wiring substrate 10 and the first semiconductor chip 1 directly or through a first insulation layer; a first concave 31 which is provided in the first heat plate 30 and to which the first semiconductor chip 1 is inserted; a second heat plate 40 which is in contact with the rear surface of the wiring substrate 10 directly or through a second insulation layer; and a first fixing member 51 which penetrates the first heat plate 30, the wiring substrate 10 and the second heat plate 40 and presses down the first heat plate 30 and the second heat plates 40 to the wiring substrate 10. COPYRIGHT: (C)2009,JPO&INPIT |
