发明名称 MANUFACTURING METHOD AND APPARATUS FOR EPITAXIAL WAFER, AND THE EPITAXIAL WATER
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of an epitaxial wafer for manufacturing the epitaxial wafer, having less crystal defects and less characteristic failures by preventing missing of As in the substrate. SOLUTION: In this manufacturing method for the epitaxial wafer, a recess 5 for holding a GaAs substrate 4 is formed in a slider 3 which forms the bottom panel of a raw material solution holder 2, and the GaAs substrate 4 is held in the recess 5 and is subjected to epitaxial growth, a GaAs polycrystal 10 is placed in the recess 5, and epitaxial growth is carried out, while making As of the GaAs polycrystal 10 sublimate at its growth. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009026788(A) 申请公布日期 2009.02.05
申请号 JP20070185350 申请日期 2007.07.17
申请人 HITACHI CABLE LTD 发明人 SHIMADA NORIO
分类号 H01L21/208;C30B23/06;C30B29/42 主分类号 H01L21/208
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