| 摘要 |
PROBLEM TO BE SOLVED: To increase the manufacturing yield of a semiconductor device in a technology of manufacturing a semiconductor device, by using a semiconductor wafer having a test element group (TEG) in scribe line regions. SOLUTION: A semiconductor wafer comprises a semiconductor substrate 1; multiple chip regions which are disposed on a surface of the semiconductor substrate and have multiple n-type or p-type transistors; scribe line regions, disposed in boundary regions between the multiple chip regions; and a multilayer wiring layer MW covering these regions. The scribe line regions include a contact test pattern Te for inspecting the electrical characteristics by using an electrical contact from the outside and a noncontact test pattern Tm for inspecting disconnection, by using an electron beam inspection apparatus. A first noncontact test element and a second noncontact test element Dm2 to be inspected in the noncontact test pattern Tm are disposed, in a region where a first contact test element De1 and a second contact test element De2 to be inspected in the contact test pattern Te are not present. COPYRIGHT: (C)2009,JPO&INPIT
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