发明名称 |
BIOCHIP PACKAGE AND BIOCHIP PACKAGING SUBSTRATE |
摘要 |
A bio-chip package is provided to maximize the efficiency of defocusing analysis by contacting the rear side of the bio-chip having high planarity degree with the focusing and leveling stage of scanner. The bio-chip package(1) comprises (a) the bio-chip(200) which has a probe array(210) on the surface and (b) the package substrate(100) which has the bio-chip mounted thereto and an opening(115) which penetrates the package substrate, and comprises the exposing unit(110) for exposing the rear side of bio-chip.
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申请公布号 |
KR20090013532(A) |
申请公布日期 |
2009.02.05 |
申请号 |
KR20070077766 |
申请日期 |
2007.08.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JUNE YOUNG;LEE, DONG HO |
分类号 |
G01N33/53;G01N33/48;G01N35/00;H01L23/045 |
主分类号 |
G01N33/53 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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