发明名称 BIOCHIP PACKAGE AND BIOCHIP PACKAGING SUBSTRATE
摘要 A bio-chip package is provided to maximize the efficiency of defocusing analysis by contacting the rear side of the bio-chip having high planarity degree with the focusing and leveling stage of scanner. The bio-chip package(1) comprises (a) the bio-chip(200) which has a probe array(210) on the surface and (b) the package substrate(100) which has the bio-chip mounted thereto and an opening(115) which penetrates the package substrate, and comprises the exposing unit(110) for exposing the rear side of bio-chip.
申请公布号 KR20090013532(A) 申请公布日期 2009.02.05
申请号 KR20070077766 申请日期 2007.08.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JUNE YOUNG;LEE, DONG HO
分类号 G01N33/53;G01N33/48;G01N35/00;H01L23/045 主分类号 G01N33/53
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