发明名称 WIRING CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of fully preventing the occurrence of a cross talk between a plurality of conductors, and to provide a production method thereof. SOLUTION: A first insulating layer 41 is formed on a suspension body part 10, and a wiring pattern for writing W1 and a wiring pattern for reading R1 are formed on the first insulating layer 41. The wiring patterns W1, R1 are aligned at a predetermined interval. A second insulating layer 42 is formed on the first insulating layer 41 so as to cover the wiring patterns W1, R1, and a third insulating layer 43 is formed on the second insulating layer 42. On the third insulating layer 43, at a position over the wiring pattern for writing W1, a wiring pattern for writing W2 is formed, and at a position over the wiring pattern for reading R1, a wiring pattern for reading R2 is formed. A fourth insulating layer 44 is formed on the third insulating layer 43 so as to cover the wiring patterns W2, R2. The dielectric constant of the third insulating layer 43 is smaller than either that of the second insulating layer 42 or of the fourth insulating layer 44. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009026909(A) 申请公布日期 2009.02.05
申请号 JP20070187803 申请日期 2007.07.19
申请人 NITTO DENKO CORP 发明人 MOTOGAMI MITSURU;KAMEI KATSUTOSHI
分类号 H05K1/02;G11B5/60;G11B21/21;H05K3/46 主分类号 H05K1/02
代理机构 代理人
主权项
地址