| 摘要 |
Considerable manufacturing efficiency and flexibility is provided by configuring the lower surface of a chip carrier to include multiple holes specifically designed to receive coupling fibers. By appropriately positioning these holes, the coupling fibers can be aligned with necessary optical elements of optoelectronic chips carried by the chip carrier. Similarly, the opposite end of the fibers can be appropriately configured and positioned for coupling to waveguide structures or fiber optic structures which may be embedded in printed circuit boards. By utilizing an appropriately configured chip carrier, and related fibers, a signal transmission structure is achieved which effectively bridges the gap between a chip carrier and a related printed circuit board.
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