发明名称 |
Heat dissipating member |
摘要 |
A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.
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申请公布号 |
US7484556(B2) |
申请公布日期 |
2009.02.03 |
申请号 |
US20060527641 |
申请日期 |
2006.09.27 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
MITA KUNIHIKO;TOMARU KAZUHIKO;AOKI YOSHITAKA;FUJIKI HIRONAO |
分类号 |
F28F7/00;F28F13/00;H01L23/373;H01L23/427;H05K7/20 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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