发明名称 Light reflection for backside illuminated sensor
摘要 <p>The present disclosure provides a backside illuminated semiconductor device. The device includes a semiconductor substrate having a front surface and a back surface, a sensor element formed on the front surface of the semiconductor substrate, and a light reflective layer (LRL) disposed over the sensor element. The LRL is configured to reflect light directed towards the back surface and through the sensor element.</p>
申请公布号 KR100881170(B1) 申请公布日期 2009.02.02
申请号 KR20080047754 申请日期 2008.05.22
申请人 发明人
分类号 H01L27/146;H01L33/00 主分类号 H01L27/146
代理机构 代理人
主权项
地址