| 摘要 |
<p>A semiconductor package and a manufacturing method thereof are provided to reduce the number of fabrication processes of the semiconductor package by simplifying the process for forming the insulating layer pattern. The first insulating layer pattern(20) having the first opening exposing a bonding pad(12) is formed. A rewiring pattern(30) arranged on the first insulating layer pattern is electrically connected with the bonding pad. The second insulating layer pattern(40) has the first opening for exposing a part of the rewiring pattern and the second opening extended from the first opening along the semiconductor chip. A conduction ball(50) is electrically connected with the exposed rewiring pattern through the first opening.</p> |
