| 发明名称 |
CIRCUIT LOGIC EMBEDDED WITHIN IC PROTECTIVE LAYER |
| 摘要 |
A system comprising a first layer comprising one or more metal sub-layers and a protective overcoat (PO) layer adjacent to the first layer. The PO layer is adapted to protect the first layer, and a circuit logic is at least partially embedded within the PO layer. The circuit logic couples to one of the metal sub-layers. |
| 申请公布号 |
US2009020313(A1) |
申请公布日期 |
2009.01.22 |
| 申请号 |
US20070781133 |
申请日期 |
2007.07.20 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
LEDUC YVES;MESSINA NATHALIE;TAYLOR KELLY J.;HUTTER LOUIS N.;SMITH JEFFREY P.;WILLIAMS BYRON L.;SINGH ABHA R.;SUMMERFELT SCOTT R.;CALLAHAN DANIEL L. |
| 分类号 |
H05K3/00;H05K1/00 |
主分类号 |
H05K3/00 |
| 代理机构 |
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