发明名称 |
WIRE-WOUND ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF WIRE-WOUND ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a wire-wound electronic component allowing its outline to be easily and accurately formed. SOLUTION: A chip inductor is characterized by including: a drum core 4 having a winding core part 4c sandwiched between flanges 4a and 4b at both its ends; a wire 12 wound around the winding core part 4c, and having both ends 12a and 12b located on the flanges 4a and 4b; internal electrodes 20a and 20b to which the ends 12a and 12b of the wire 12 are connected on the flanges 4a and 4b; and a magnetic tape 32 wound to cover the wire 12 in the winding core part 4c. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009016563(A) |
申请公布日期 |
2009.01.22 |
申请号 |
JP20070176454 |
申请日期 |
2007.07.04 |
申请人 |
TDK CORP |
发明人 |
SAITO HIROSHI;AKASAKA AKIRA;ABE KAZUYA;SATO TOSHIHIKO |
分类号 |
H01F27/02;H01F17/04;H01F41/04 |
主分类号 |
H01F27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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