| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor element, having not only light transmissivity but also low moisture absorption, small internal stress and excellent resin crack resistance to mechanical stress. SOLUTION: The epoxy resin composition for sealing the optical semiconductor element contains the following components (A) to (D): (A) an epoxy resin component containing an alicyclic epoxy resin represented by structural formula (1) as an essential component; (B) a curing agent; (C) a curing accelerator; and (D) a thiol. COPYRIGHT: (C)2009,JPO&INPIT
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