| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module with excellent heat radiation performance, sufficient bonding strength and excellent conductivity further by preventing the generation of a warp convexed upwards on a heat radiation plate fixed on a cooler and securing adhesion between the heat radiation plate and the cooler. <P>SOLUTION: In the power module, an insulating layer is formed by thermally spraying ceramic (silicon nitride, aluminum nitride, alumina or zirconia) onto the heat radiation plate, and an energizing layer is formed by coating a metal (pure copper or copper alloy) on the insulating layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
